FIB Circuit Edit and Debug Service

ACE provides IC design verification and debug services using the FIB (focused ion beam). FIB can be used to perform probe point creation as well as circuit edits and modifications on flip chips and wire bond devices.

FIB capabilities include:

  • Precision flip chip and front side circuit edits on 10nm Cu devices using the state of the art OptiFIB™ and IDS P3X™
  • Local de-processing
  • Low current end point detection
  • Copper selectivity over ILD low-K using Credence proprietary Cu etch
C U Etch